2026-05-06T18:25:17.193Z http://ezaposleni.singidunum.ac.rs/rest/sciNaucniRezultati/oai

ezaposleni.singidunum.ac.rs/rest/sciNaucniRezultati/oai:2:11878 2026-04-13T08:49:45Z 2

Adaptive Digital Control Architecture for Multi-Agent Industrial Electroplating Lines: A Modular Microcontroller-Based Approach 2026 http://ezaposleni.singidunum.ac.rs/rest/sciNaucniRezultati/oai/record/2/11878 https://www.mdpi.com/2079-9292/15/8/1588 N. Andrijević Z. Lovreković V. Đokić J. Perišić M. Milovanović This paper presents a deterministic embedded control architecture for an industrial electroplating line. The validated system includes two autonomous trolleys, 18 station-aligned process positions, shared-track motion, and redundant grouped baths. The proposed controller addresses the limitations of rigid sequential automation by combining asynchronous finite-state trolley execution, runtime allocation of equivalent technological stations, dwell-time-preserving retrieval, distributed thermal supervision, and layered fail-safe protection within a single ATmega2560-based implementation. The core contribution is the integration of virtual process groups and temporal FIFO logic into a compact plant-side embedded controller. This enables adaptive bath selection and process-completion-based retrieval without reliance on a real-time operating system or a computationally heavy supervisory runtime. The architecture also incorporates predictive pre-start validation, runtime software arbitration, hardware-wired interlocks, binary-coded trolley positioning, and a distributed 1-Wire thermal measurement network. Validation was performed in a controller-centered hardware-in-the-loop representation of an 18-station zinc electroplating line. Over a 100-batch horizon, the proposed architecture reduced makespan from 1642 min to 1244 min, corresponding to a 24.2% throughput improvement. Average trolley idle time decreased from 18.4 min/batch to 4.1 min/batch. Grouped-bath utilization increased from 64% to 91%, while tracked bottleneck incidents decreased from 18 to 2. These results show that adaptive, resource-aware, and safety-layered electroplating control can be realized effectively on a compact embedded platform in an industry-representative HIL setting, while preserving dwell-time integrity and controller-level safety invariants. article https://doi.org/10.3390/electronics15081588 15 8:1588 2079-9292 ELECTRONICS